Dry Graphene Transfer from Metal Foils

ABSTRACT

A method for dry graphene transfer comprising growing graphene on a growth substrate, chemically modifying a transfer substrate to enhance its adhesion to graphene, contacting the graphene on the growth substrate with the transfer substrate and transfer printing; and separating the transfer substrate with attached graphene from the growth substrate. The growth substrate may be copper foil. The transfer substrate may be a polymer, such as polystyrene or polyethylene, or an inorganic substrate. Also disclosed is the related composite material made by this process.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application61/466,248 filed on Mar. 22, 2011 by Evgeniya H. Lock et al., entitled“Dry Graphene Transfer to Polymers,” the entire contents of which areincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates generally to graphene transfer and morespecifically to dry graphene transfer from metal foils.

BACKGROUND OF THE INVENTION

Interest in organic electronics comes from the low cost of plastics, andthe relative ease of organic compounds processing with most successfulapplication in organic light-emitting devices (OLEDs), thin-filmtransistors (TFTs) and thin film organic photovoltaic cells. See, e.g.,S. R. Forrest, The path to ubiquitous and low-cost organic electronicappliances on plastic, Nature, 428, 911-918 (2004); C. D. Sheraw et al.,Organic thin-film transistor-driven polymer-dispersed liquid crystaldisplays on flexible polymeric substrates, Appl. Phys. Lett., 80(6),1088-1090 (2002); D. R. Hines et al., Nanotransfer printing of organicand carbon nanotube thin-film transistors on plastic substrates, Appl.Phys. Lett., 86, 163101 (2005); and H. Hoppe et al., Organic solarcells: an overview, J. Mater. Res., 19(7), 1924-1945 (2004), the entirecontents of each are incorporated herein by reference. Flexibleelectronic devices typically rely on the conducting properties of smallmolecules, conductive polymers and biological materials. However, theirinherent low carrier mobilities (<1 cm²V⁻¹s⁻¹), low electricalconductivity (σ˜10⁻⁶ S cm⁻¹) and low charge carrier velocity (10 cm s⁻¹)represent serious limitation and underlines the need of perfecttransparent conductor that will possess both the flexibility of organicsand higher carrier mobilities. Graphene has emerged as this long soughtconductor due to its zero-band gap, extremely high electron mobilitiesof 10,000-70,000 cm²V⁻¹s⁻¹, and low absorption (2.3%) in the visiblespectrum. See, e.g., W. Warta et al., Ultrapure, high mobility organicphotoconductors, Appl. Phys. A, 36, 163-170 (1985); P. E. Burrows etal., Electroluminescence from trap-limited current transport in vacuumdeposited organic light emitting devices, Appl. Phys. Lett., 64,2285-2287 (1994); F. Schwierz, Graphene transistors, NatureNanotechnol., 5, 487-496 (2010); and F. Bonaccorso et al., Graphenephotonics and optoelectronics, Nature photonics, 4, 611-622 (2010), theentire contents of each are incorporated herein by reference. Successfulgraphene incorporation into plastics shows promise in the production offlexible touch screens, displays, smart windows as well as a viablereplacement for ITO technology. See, e.g., J. K. Wassei et al.,Graphene, a promising transparent conductor, Materials today, 13(3),52-59 (2010); L. G. D. Arco et al., Continuous, highly flexible, andtransparent graphene films by chemical vapor deposition for organicphotovoltaics, ACS Nano, 4(5), 2865-2873 (2010); and P. Matyba et al.,Graphene and mobile ions: the key to all-plastic, solution processedlight-emitting devices, ACS Nano, 4(2), 637-642 (2010), the entirecontents of each are incorporated herein by reference. However, a trulymanufacturable process in any of the above mentioned applicationsrequires controlled, uniform graphene growth and precise grapheneplacement on top of organic surfaces, along with the development ofcost-effective techniques for organic device fabrication.

High-quality graphene is typically produced via thermal graphitizationof SiC, or chemical vapor deposition (CVD) on metals substrates, withthe latter showing the most promise for lower cost and scalability tolarge areas. See, e.g., X. Li et al., Large-area synthesis ofhigh-quality and uniform graphene films on copper foils, Science, 324,1312-1314 (2009) and S. Bae et al., Roll-to-roll production of 30-inchgraphene films for transparent electrodes, Nature Nanotechnol., 5,574-578 (2010), the entire contents of each is incorporated herein byreference. For device fabrication, graphene has to be transferred tosemiconductor or plastic substrates. Typically, the graphene transferprocedure involves using a polymer mediator (PMMA or PDMS) to keep thegraphene film intact and prevent folding while the Cu foil is chemicallyetched. The latter requires strong acids such as HNO₃, which oftenproduces hydrogen bubbles and damages the graphene. See, e.g., W. Reganet al., A direct transfer of large-area graphene, Appl. Phys. Lett., 96,113102 (2010) and K. S. Kim et al., Large-scale pattern growth ofgraphene films for stretchable transparent electrodes, Nature, 457,706-710 (2009), the entire contents of each is incorporated herein byreference. Aqueous iron chloride (FeCl₃) has been explored as a mildalternative to acid etching, but the metal foil etching step is ahazardous and time consuming process that can take up to twelve hours tocomplete. See, e.g., V. P. Verma et al., Large-area graphene on polymerfilm for flexible and transparent anode in field emission device, Appl.Phys. Lett., 96, 203108 (2010), the entire contents of which areincorporated herein by reference. Extensive soaking of the graphene/PMMAstack in deionized water is needed for the removal of the etchant'sresiduals. This step may also take hours. After the metal foil isdissolved, the graphene/PMMA stack is placed onto an arbitrary surfaceand the polymer mediator is dissolved in acetone to yield “pristine”graphene on semiconductor or polymer substrate. The detrimental effectof the polymer solvent residues in graphene has been recognized andinclude introduction of variety of defects into the graphene layer.Thus, alternative approaches to the use of polymer substrate as amediator mainly involving thermal release tape have been explored. See,e.g., J. D. Caldwell et al., Technique for the dry transfer of epitaxialgraphene onto arbitrary substrates, ACS Nano, 4(2), 1108-1114 (2010); Y.Lee et al., Wafer-scale synthesis and transfer of graphene films, NanoLett., 10, 490-493 (2010); and L. Song et al., Transfer printing ofgraphene using gold film, ACS Nano, 3(6), 1353-1356 (2009), the entirecontents of each are incorporated herein by reference. As an example,the protocol used by Bae et al. involves placing tape/graphene/Cu stackbetween two rollers at 0.2 MPa pressure, then the Cu foil is chemicallyetched. The Gr/tape stack is washed with diionized water and placed ontarget substrate. Gr/tape/substrate is exposed to mild heat (90-120° C.)to remove tape residues. While the protocol for transfer varies betweenresearch groups, the metal foils are always chemically etched, which istime consuming, the graphene film is altered by the exposure tochemicals, the metal substrates are destroyed and hazardous chemicalwaste is generated—none of which is desirable for a large scale deviceproduction.

BRIEF SUMMARY OF THE INVENTION

The aforementioned problems are overcome in the present invention whichprovides a method for dry graphene transfer comprising growing grapheneon a growth substrate, chemically modifying a transfer substrate toenhance its adhesion to graphene, contacting the graphene on the growthsubstrate with the transfer substrate and transfer printing; andseparating the transfer substrate with attached graphene from the growthsubstrate. The growth substrate may be copper foil. The transfersubstrate may be a polymer, such as polystyrene or polyethylene, or aninorganic substrate. Also disclosed is the related composite materialmade by this process.

These and other features and advantages of the invention, as well as theinvention itself, will become better understood by reference to thefollowing detailed description, appended claims, and accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart of the transfer process. In step 1, graphene filmwas grown on Cu foil and independently the polymer surface was treatedto increase reactivity. In step 2, both substrates were placed in a NX2000 Nano Imprinter. In step 3, the substrates were separated andgraphene was transferred to the polymer.

FIG. 2 shows high-resolution C1s region of polystyrene (PS-H) before andafter plasma exposure.

FIG. 3 shows XPS survey spectra of every step of the polymer preparationbefore print and the corresponding spectra after print.

FIG. 4 is an attachment schematic: a) hydrogen bond attachment betweenthe amine groups of the TFPA and the hydroxyls and carboxyl groups ofthe plasma treated polystyrene surface and b) covalent bond attachmentbetween TFPA and the plasma treated polystyrene surface. To form anamide bond the carboxyl groups on the polymer surface were reacted withNHS-EDC chemistry prior to TFPA deposition.

FIG. 5 shows Raman spectra of polystyrene and polyethylene before andafter print.

FIG. 6 shows Raman spectra of D, G and 2D regions of polystyrene (a-c)and polyethylene (d-f) before and after print.

FIG. 7 shows (a) microraman maps of PS H, PS R and PS Ref after print,(b) the corresponding raman spectra at chosen points of each map, and 9(c) optical photographs of the residual graphene left over on SiO₂/Sisurface after graphene transfer to PS H, PS R and PS Ref. The inset inPS Ref optical photograph is microscope image over 1 mm area.

FIG. 8 shows sheet resistance of polystyrene and polyethylene before andafter print.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed towards a method of dry graphenetransfer from a growth substrate (for example but not limited to copperfoil, silicon carbide, boron nitride, etc.) to a transfer substrate,which may a polymer (for example but not limited to oxygen containingpolymers, nitrogen containing polymers, esters, etc.) or an inorganicsubstrate (for example but not limited to oxides, nitrides, metals,silicon, and silicon oxide). In a preferred embodiment, the transfersubstrate is polystyrene or polyethylene. One preferred embodimentrelies on the differential adhesion between the growth substrate and thetransfer substrate against the graphene layer. Thus, when thegraphene-transfer substrate cohesive strength is higher than that of thegraphene-growth substrate, a successful print is observed. Thisstraightforward approach eliminates damage to the graphene associatedwith wet chemical transfer techniques, reduces the transfer time andpreserves the metal foil substrates.

The method of dry graphene transfer relies on three distinct steps asshown in FIG. 1. In the first step, graphene was grown via CVD on a Cufoil and separately, the polymer surface was treated to enhance itsadhesion to graphene. The latter process involved plasma-based surfaceactivation and the deposition of N-ethylamino-4-azidotetrafluorobenzoate(TFPA-NH₂) linker molecule. Instead of a polymer, the same two stepprocess could be applied for surface preparation of inorganicsubstrates, including SiO₂, Al₂O₃, GaN and SiC, provided the plasmatreatment and the end functional group of the azide linker molecule areprecisely adjusted. In this case the plasma treatment should be in gasproducing hydroxyl (OH) and/or carboxyl (COOH) functional groups oramines (NH₂) and the azide molecule should have a phosphate end group.

In the second step, the TFPA treated polymer surface was placed incontact with graphene covered Cu foil and printed, under heat andpressure, in a NX 2000 Nano Imprinter. In the final step, the polymersubstrate with attached graphene was separated from the metal foil. Toensure successful transfer, the adhesion on two interfaces polymer/TFPAand TFPA/graphene has to be higher than the adhesion between grapheneand Cu. Each step is described in detail in the following sections.

Step 1: Graphene Growth on Cu and Polymer Surface Preparation

Graphene was grown on Cu foils following procedure outlined by X. Li etal., Large-area synthesis of high-quality and uniform graphene films oncopper foils, Science, 324, 1312-1314 (2009). The developed dry graphenetransfer process relies on the differential adhesion betweengraphene/growth substrate and the receiving substrate. If the bondstrength between graphene and the receiving substrate is high enoughcompared to the van der Waals graphene/metal foil interactions, graphenecan be transferred to any substrate. Thus, the key for graphene transferis the polymer surfaces preparation prior transfer print. The polymersof choice are polystyrene (PS) and polyethylene (PE) because ofsimplicity of their chemical structure containing only carbon andhydrogen and in the same time providing us with insight of the howimportant are the aromatic domains of polystyrene vs. the aliphaticpolymer chains of polyethylene. Polystyrene was purchased from Tekra,while the ultra-high molecular weight polyethylene was purchased fromGoodfellow. Also, it should be taken into account that polystyrene is anamorphous polymer with randomly oriented domains, whereas ultra-highmolecular weight polyethylene has crystalline domains that are embeddedinto the amorphous matrix.

Plasma Treatment

Polystyrene and polyethylene are chemically inert and so their surfacesmust be chemically modified prior to TFPA molecule attachment.Plasma-based functionalization was chosen because it enables theincorporation of a variety of chemically reactive moieties (E. H. Locket al., Surface composition, chemistry and structure of polystyrenemodified by electron-beam-generated plasma, Langmuir, 26(11), 8857-8868(2010), the entire contents of which is incorporated herein byreference). In this case electron beam-generated plasma was used tointroduce oxygen functional groups such as hydroxyls, carboxyls, andcarbonyls. The plasma can produce OH, COOH, a combination of OH andCOOH, or NH₂ groups on the surface.

The electron beam was produced by applying a −2 kV pulse to a linearhollow cathode for a selected pulse width and duty factor. The emergentbeam passed through a slot in a grounded anode and was then terminatedat a second grounded anode located further downstream. The electron beamvolume between the two anodes defines the ionization source volume, withthe dimensions set by the slot size (1×25 cm²) and the anode-to-anodelength (40 cm). Beam spreading from collisions with the background gaswas suppressed by a co-axial magnetic field (150 Gauss) produced by aset of external coils. Because the beam is collimated, few high energyelectrons strike the surface of the material. The system vacuum wasmaintained by a 250 l/s turbo pump, with a base pressure of 5×10⁻⁶ Torr.The operating pressure was achieved by introducing CO₂ (purity >99.995%)through the mass flow controllers and throttling the pumping speed usinga manual gate valve. The samples were placed on a 10.2 cm diameter stagelocated at 2.5 cm from the nominal edge of the electron beam. The stagewas held at ground potential and room temperature. Polymers were treatedat a pressure of 100 mTorr, treatment time of 1 minute and duty factorof 10%.

After CO₂ plasma high oxygen incorporation was detected. In the case ofpolystyrene and polyethylene the amounts were 17 at. % and 15 at. %respectively (FIG. 3, Table I). A closer look in the C1s region revealedthat multiple types of oxygen functionalities were incorporated into thepolymer structure for both polymers including hydroxyls (C—O), carbonyls(C═O), carboxyls (COOH) and carbonates (CO₃) in different ratios withthe highest concentration of hydroxyls (FIG. 2, Tables II, III).

TABLE I Elemental composition of polymer surfaces before and after printElement References Plasma treatment Polymers before print Polymers afterprint (at. %) PS PE PS PE PS H PS R PE H PE R PS H PS R PS Ref. PE H PER PE Ref. C1s 97.13 95.53 82.89 84.84 79.71 81.05 81.16 86.71 87.9983.89 9.7 99.61 98.73 100 O1s 2.87 4.47 17.10 15.06 12.04 11.26 12.779.81 9.75 12.73 3.3 0.39 1.27 0 N1s ND ND ND ND 4.17 3.97 3.19 2.03 1.111.35 ND ND ND ND F1s ND ND ND ND 3.9 3.73 2.87 1.46 1.52 2.09 ND ND NDND ND, not detected.

A closer look in the C1s region (Tables II, III) reveals that multipletypes of oxygen functionalities were incorporated into the polymerstructure for both polymers including hydroxyls (C—O), carbonyls (C═O),carboxyls (COOH) and carbonates (CO₃) in different ratios. Whereas theconcentration of hydroxyls is the highest (4.62 at. % for PS; 5.27 at. %for PE) for both polymers, the presence of other oxygen functionalitieswas polymer specific. For polystyrene, carbonyls and carbonates hadapproximately equal concentrations of 2 at. % and carboxyl concentrationis 1 at. %. For polyethylene, carbonyl (3.13 at. %) and carboxyls (3.53at. %) concentrations were comparable. The samples also contained 1.5at. % of carbonate. After plasma treatment due to substitution into thebenzene rings the π-π* feature characteristic for benzene ringsorganization on the surface is reduced by a factor of three.

TABLE II C1s high resolution spectra analysis of polystyrene PS PlasmaBefore Print After print Group Ref. treatment PS H PS R PS H PS R PSRef. C—C, sp² 92.13 60.51 58.11 61.68 69.96 62.99 88.90 C—CO₂ (C—N)11.63 10.0 9.16 8.71 9 — C—O (C═N) (C—CF) 1.76 4.62 5.88 4.87 4.44 6.063.08 C═O (C—F) — 1.98 3.22 3.21 2.25 2.99 — COOH (O═C═N) — 0.99 2.35 1.71.64 1.9 — CO₃ — 2.01 — — — — — π-π* (CF₂) 3.24 1.17 1.2 1.23 1 0.974.71 C (total) 97.13 82.89 80.77 81.85 87.99 83.89 96.70

TABLE III C1s high resolution spectra analysis of polyethylene PE PlasmaBefore Print After print Group Ref. treatment PE H PE R PE H PE R PERef. C—C, sp² 92.37 54.98 55.86 67.06 89.13 89.42 91.74 C—CO₂ (C—N) —16.55 12.19 11.21 8.49 6.94 6.4 C—O (C═N) (C—CF) 3.16 5.27 5.48 4.101.99 2.37 1.86 C═O (C—F) — 3.13 4.34 3.11 — — — COOH (O═C═N) — 3.53 3.301.24 — — — CO₃ — 1.48 — — — — — C (total) 95.53 84.94 81.16 86.71 99.6198.73 100

TFPA Molecule Attachment

The azide molecule used in this study TFPA-NH₂ is soluble in methanol,and can thus be used with a large variety of organic substrates. It wassynthesized as follows. All starting materials were of reagent grade andused without further purification.N-succinimidyl-4-azidotetrafluorobenzoate was synthesized from apreviously published procedure [ref]. ¹H-NMR was performed on a BrükerADVANCE 300 spectrometer. N-ethylamino-4-azidotetrafluorobenzoate (1):To a 250 mL round bottom was added ethylenediamine (6.36 g, 105.8 mmol)and 100 mL acetonitrile. The mixture was cooled to 0° C. and(N-succinimidyl-4-azidotetrafluorobenzoate (2.00 g, 6.02 mmol) in 25 mLacetonitrile was added dropwise over 20 min. The reaction was stirred at0° C. for an additional 1 h and the white precipitate that had formedfiltered using a Buchner funnel. To the filtrate was added 100 mLchloroform and washed with water (3×50 mL) and dried over magnesiumsulfate. The solvent was removed in vacuo and the solid was vacuum driedto yield 1 (1.25 g, 75%) as a yellow solid. ¹H-NMR (300 MHz, CDCl₃): δ6.64 (br, 1H), 3.45 (m, 2H), 2.92 (m, 2H). ¹³C-NMR (75 MHz, CDCl₃): δ168.61, 160.25, 25.63.

For successful graphene transfer, there should be a uniform monolayer ofTFPA-NH₂ that is properly oriented. That is the NH₂-end group should beattached to the polymer and the azide end group is attached to graphene.This is ensured since the azide end group of TFPA-NH₂ molecule is onlyactivated via heat (T>140° C.) or UV exposure and thus will not reactwith the plasma activated polymer surface during deposition.

To explore bond strength requirements at the TPFA/polymer interface, twodifferent attachment protocols were developed. In the first approach,the TFPA molecule was attached to the plasma functionalized polymersurfaces via its amine end group to carboxyl and hydroxyl groups on thebasis of hydrogen bond (FIG. 3 a, heron referred to as PS-H) by placingthe samples in 4 mM TFPA solution for two hours, then the surfaces wereextensively rinsed and sonicated for 10 minutes in methanol and finallydried with nitrogen. In the second, the carboxyl groups present on thepolymer surface were reacted with EDC/NHS to form a covalent amide bondbetween the TFPA and the polymer (FIG. 3 b, heron referred to as PS-R).Ethyl-3-[3-dimethylaminopropyl]carbodiimide hydrochloride (EDC) andN-hydroxysuccinimide (NHS) were purchased from Thermo Fisher Scientific.2-[morpholino]ethanesulfonic acid (MES), NaCl, and sodium phosphate werepurchased from Sigma Aldrich. Activation buffer was composed of 0.1MMES, 500 mM NaCl, and the pH was adjusted to 6.0. Coupling buffer wasmade from 100 mM sodium phosphate, 150 mM NaCl, and the PH was adjustedto 7.2. A solution of EDC (2 mM) and NHS (5 mM) in activation buffer wasfreshly prepared prior to each reaction. Approximately 200 μl of theEDC/NHS solution was drop coated over the carboxyl terminatedsubstrates. After 15 min for reaction, excess EDC/NHS was removed byrinsing with copious amounts of coupling buffer. The dip coatingprocedure was the same as in Scheme 1 and it included placing thesamples in 4 mM TFPA solution for two hours, then the surfaces wereextensively rinsed and sonicated for 10 minutes in methanol and finallydried with nitrogen.

Elemental X-ray photoelectron spectroscopy (XPS) analysis of TFPA coatedpolystyrene and polyethylene using both attachment schemes revealsnitrogen and fluorine incorporation in all cases. However, the level ofincorporation is different—in the case of polystyrene both PS H and PS Rsamples before print contain approximately 4 at. % of nitrogen and 4 at.% fluorine (Table I). In the case of polyethylene PE H contains 3 at. %of nitrogen and 2.9 at. % of fluorine, PER contains 2 at. % of nitrogenand 1.5 at. % of fluorine (Table I). These lower numbers suggest lowerTFPA coverage on polyethylene in comparison with polystyrene. Properinterpretation of the group distribution on the polymer surface afterPFPA deposition is difficult because different chemical groups e.g. C—O,C═N, C—CF; C═O, C—F and COOH, O═C═N (see Tables II, III) overlap in thespectrum.

Step 2: Transfer Printing

The TFPA coated polymer substrates were brought into contact with agraphene covered Cu foil at a pressure of 3.4 MPa and heated to 150° C.for 30 minutes. The azide-end of the TFPA molecule was activated and acovalent azide bond between the graphene and the TFPA was formed. Itshould be noted that these transfer print conditions were not optimized.The same results might be achieved with pressure much lower than 3.4MPa. Also the TFPA-NH₂ molecule could be UV activated. As a control,unmodified PS and polyethylene PE substrates (hereon referred to as PSref and PE Ref) were also printed against graphene on Cu foil.

Step 3: Separation of Polymer and Cu Foil

After printing, the polymer substrates were separated from the Cu foil.

To evaluate the quality of the transferred graphene onto polystyrene andpolyethylene substrates Raman spectroscopy and Microraman imaging wereperformed. Raman spectra were acquired using a Renishaw In Via Ramanmicroscope with a constant power of 20 mW of power, and exposure time of20 seconds. A Horiba, LabRAM ARAMIS Confocal Raman microscope equippedwith 532 nm laser was used for the microraman maps. The microscope wascalibrated to the 520.7 cm⁻¹ peak of a silicon (111) wafer to within ±2cm⁻¹ prior to each measurement. All measurements used an exposure timeof 10 seconds and were averaged over two exposures. The spot size of thelaser when focused on the sample surface is approximately 1 μm. TheDuoScan feature of the ARAMIS microscope was used to raster the laserspot over a 2 μm square. A general bandwidth of 100 cm⁻¹ for polystyrenecentered at the peak maximum with the baseline removed was used forintegration. Peak selection and integration was preformed with LabSpec 5version 5.55.10 software provided by Horiba Scientific. The Cu foilresiduals were analyzed as well. The electrical properties of bothpolymers before and after transfer were evaluated via sheet resistancemeasurements.

After graphene transfer print to polystyrene and polyethylene as shownin FIG. 3, the concentration of N and F in PS H and PS R wassignificantly reduced and these elements were undetectable for PE H andPE R. In the same time the total amount of carbon on the both polymerswas increased suggesting that deposition onto the polymer surfacesoccurred. Raman spectra (FIG. 5) show appearance of 2D peak at 2686 cm⁻¹for PS H and PS R and G peak at 1586 cm⁻¹ for PE H and PE R signifyinggraphene presence onto the polymer surface. In the G-region polystyrenehas inherent peak at 1586 cm⁻¹, however after transfer the relative peakintensity was increased. In 2D region, polyethylene has inherent peak,however after transfer the peak became doubled shouldered (firstshoulder at 2686 cm⁻¹) due to graphene incorporation.

In some areas graphene was transferred to polystyrene and polyethylenereferences. After graphene print to PS ref the total amount of oxygenwas unchanged, however closer look in the C1s region revealed that theconcentration of π-π* feature characteristic for benzene rings presenton the surface was increased from 3 at. % to ca. 5 at. % (Table II).This could only occur due to graphene deposition. When graphene wasprinted onto polyethylene reference the small amount of oxygen presentonto the polymer surface was completely undetectable (Table III). Ramanspectra (FIG. 5) also confirm the transfer for PS ref and PE ref. XPSanalysis of the Cu foil before and after print to both polymersubstrates (Table IV) show an increase in oxygen concentrationapproximately by a factor of five and reduction in Cu concentrationapproximately by a factor of two. These results thus suggest thatgraphene was removed from the Cu foil.

TABLE IV Elemental composition of Cu foil before and after transfer.Graphene Gu foil After Print to polystyrene Cu foil after print topolyethylene Element on Cu foil PS H PS R PS REF PE H PE R PE Ref C1s51.69 58.40 46.36 56.20 54.53 59.18 52.12 O1s 4.87 21.98 25.44 22.0718.86 20.04 23.94 Cu2p 43.45 19.62 28.20 21.74 26.61 20.79 21.52

A more careful investigation of the three significant regions ingraphene identification G and 2D showing ordered graphitic structure andD region showing defects in the graphene structure (FIG. 6) suggestshigh quality monolayer transfer based on peak positions and peak width(<30 cm⁻¹). A closer look at D region shows that no defects wereintroduced during transfer, i.e. no peaks at 1350 cm⁻¹ after print forboth polymers (PS H, PS R, PS ref, PE H, PE R, PE Ref).

While the Raman spectra shown in FIG. 5 clearly verify the successfultransfer printing of graphene onto polymer substrates, it does notprovide sufficient information about the uniformity of the printedgraphene layer. Microraman mapping, shown in FIG. 7 a of the 2D peakover 90 μm area was performed to better examine this issue in the caseof polystyrene. The PS H and PS R show uniform coverage, which was notthe case for PS-Ref. It should be noted that the polymer surfaceroughness after print over 50 μm scan area was ˜1 μm suggesting veryrough surface and thus intensity variation over large area is notsurprising. To better characterize this phenomenon Raman spectra ofselected points are plotted in FIG. 5 b and based on these measurementswe can conclude that intensity lower than 200 (dark blue color)corresponds to bare polymer. Intensities above that correspond totransferred graphene and the intensity or color variation (light blue tored) reflects the variation in morphology. Alternatively, the uniformityof the transferred graphene layer on macroscale can be evaluated byanalyzing the graphene residuals on the Cu foil after transfer printing(FIG. 5 c). This was accomplished by transferring the residuals from theprinted Cu foil to Si using the wet transfer process described above. Itis clear that full transfer of graphene onto the PS-H and PS-Rsubstrates was achieved. In this work the polymer samples were smallerthan the graphene/Cu substrates and so, the residues on the Si wafersare the edges of the Gr/Cu foil that did not come into contact with thepolymer surface during print. In the case of PS Ref, only a partialtransfer was observed and the microscope image (FIG. 5 c inset) clearlyshows graphene on the SiO₂/Si surface.

Samples were electrically characterized using a standard 4-probe stationwith 1 mm spaced probe tips. FIG. 5 shows the 4-probe sheet resistanceof the samples before and after graphene transfer. The insulatingpolymer surface was indeed found to be conducting after transfer withlow sheet resistances of 1 kΩ/sq (PS H) and 3 kΩ/sq (PS R). These valuesare consistent with the sheet resistance (˜1 kΩ/sq) of monolayergraphene transferred to PET and SiO₂/Si (V. P. Verma et. al, Large-areagraphene on polymer film for flexible and transparent anode in fieldemission device, Appl. Phys. Lett. 96, 203108 (2010); X. Li et al.,Transfer of large-area graphene films for high-performance transparentconductive electrodes, Nano Lett., 9(12), 4359-4363 (2009); and J. W.Suk et. al, Transfer of SVD-Grown monolayer graphene onto arbitrarysubstrates, ACS Nano 5 (9), 6912-6924 (2011), the entire contents ofeach are incorporated herein by reference). The reference sample (PSRef) did not show measurable conductivity, which is consistent withincomplete graphene transfer. The electrical conductivity, carrierdensities and mobilities of the transferred graphene films for PS H andPS R were determined at 300 K by Hall measurements using copper pressureclips in a van der Pauw configuration over areas of 0.5×0.5 mm². Thecurrents used for the measurements were 1 and 50 μA, while the magneticfield was approximately 2 kG. The measured conductivities were increasedfrom ˜10⁻⁶ S/m before print to ˜5×10⁵ S/m after print. The carrierdensities for PS R and PS H were 1.6×10¹³ cm⁻² and 5.6×10¹² cm⁻²respectively, with corresponding mobilities of 1140±71 cm²/Vs. Thesevalues are on par or better than those reported for graphene transferredfrom SiC to SiO₂/Si (J. D. Caldwell et al., Technique for the drytransfer of epitaxial graphene onto arbitrary substrates, ACS Nano 4(2), 1108-1114 (2010)), the entire contents of which is incorporatedherein by reference) and the calculated values for graphene transferredfrom Cu foils to glass (J. W. Suk et. al, Transfer of SVD-Grownmonolayer graphene onto arbitrary substrates, ACS Nano 5 (9), 6912-6924(2011), the entire contents of which is incorporated herein byreference), suggesting the developed transfer method provides apromising route for graphene transfer to organics.

Understanding the graphene transfer to polystyrene and polyethylenereferences lies in analyzing the effects of the chosen printingconditions (150° C. and 500 psi) on the polymer structure. In the caseof polystyrene, transfer was not uniform. Indeed there were large areaswhere no graphene was detected even though the printing occurs wellabove its glass transition temperature (100° C.) allowing for increasedchain mobility. In the case of polyethylene, the transfer could beaffected by the melted crystalline domains in the polymer (peak meltingtemperature of 137° C.) (S. M. Kurtz, The UHMW PE Handbook: ultra-highmolecular weight polyethylene in total joint replacement, Elsevier Inc.San Diego Calif. (2004), the entire contents of which is incorporatedherein by reference).

The experimental evidence suggests successful graphene transfer to bothhomopolymers—polyethylene and polystyrene. However, the sheet resistancemeasurements indicate that the coverage among different samples, anddifferent polymers (PS vs. PE) is different. Successful graphenetransfer may rely on the creation of uniform PFPA monolayer allowing forproper azide-groups presentation toward the graphene sheet beforeprinting. The print to untreated polymers is governed by theirmicrostructure and chemical composition.

The transfer printing results presented above are a clear indicationthat high quality monolayer graphene can be directly printed to a deviceappropriate substrate providing that the adhesion between thegraphene/device substrate is higher than the growth/substrate adhesion.The developed method generates no chemical waste, allows the metal foilsto be reused and causes no changes in the graphene electricalproperties. The observed difference in the sheet resistance is linked tothe graphene coverage. For a complete graphene coverage (PS H and PS R)very low sheet resistance were measured. Hydrogen bond on TFPA/polymerinterface provided sufficient adhesion for graphene transfer. Thesynthesized azide molecule could be applied for coating of a wide rangeof organics thus extending the range of possible substrates to whichgraphene can be transferred. Similarly, other growth foils could be usedas well.

The above descriptions are those of the preferred embodiments of theinvention. Various modifications and variations are possible in light ofthe above teachings without departing from the spirit and broaderaspects of the invention. It is therefore to be understood that theclaimed invention may be practiced otherwise than as specificallydescribed. Any references to claim elements in the singular, forexample, using the articles “a,” “an,” “the,” or “said,” are not to beconstrued as limiting the element to the singular.

1. A method for dry graphene transfer comprising: growing graphene on agrowth substrate; chemically modifying a transfer substrate to enhanceits adhesion to graphene; contacting the graphene on the growthsubstrate with the transfer substrate and transfer printing; andseparating the transfer substrate with attached graphene from the growthsubstrate.
 2. The method of claim 1, wherein chemically modifying thetransfer substrate comprises a plasma modification step followed by amolecule deposition step.
 3. The method of claim 2, wherein the plasmaproduces OH, COOH, a combination of OH and COOH, or NH₂ groups on thesurface of the transfer substrate.
 4. The method of claim 2, wherein themolecule to be deposited is selected based on the transfer substrate. 5.The method of claim 4, wherein the transfer substrate comprises SiO₂,Al₂O₃, GaN, or SiC and the molecule comprises an azide molecule with aphosphate end group.
 6. The method of claim 4, wherein the transfersubstrate comprises a polymer and the molecule comprises an azidemolecule with an NH₂ end group.
 7. The method of claim 1, wherein thegrowth substrate comprises copper foil.
 8. The method of claim 1, whenthe growth substrate comprises a transition metal foil.
 9. The method ofclaim 8, wherein the transition metal foil comprises ruthenium, iridium,nickel, or any combination thereof.
 10. The method of claim 1, whereinthe growth substrate comprises silicon carbide or boron nitride.
 11. Themethod of claim 1, wherein the transfer substrate comprises a polymer.12. The method of claim 1, wherein the transfer substrate comprises ahomopolymer.
 13. The method of claim 12 wherein the homopolymercomprises polystyrene, polyethylene, polypropylene, or any combinationthereof.
 14. The method of claim 1, wherein the transfer substratecomprises an oxygen containing polymer, a nitrogen containing polymer,or both.
 15. The method of claim 1, wherein the transfer substratecomprises a polyester, polyacrylate, polycarbonate, or any combinationthereof.
 16. The method of claim 1, wherein the transfer substratecomprises an inorganic substrate.
 17. The method of claim 1, wherein thetransfer substrate comprises SiO₂, Al₂O₃, GaN, or SiC.
 18. A compositematerial made by the process comprising the steps of: growing grapheneon a growth substrate; chemically modifying a transfer substrate toenhance its adhesion to graphene; contacting the graphene on the growthsubstrate with the transfer substrate and transfer printing byapplication of heat and pressure or by exposure to UV light; andseparating the transfer substrate with attached graphene from the growthsubstrate.
 19. The composite material of claim 18, wherein chemicallymodifying the transfer substrate comprises a plasma modification stepfollowed by a molecule deposition step.
 20. The composite material ofclaim 19, wherein the plasma produces OH, COOH, a combination of OH andCOOH, or NH₂ groups on the surface of the transfer substrate.
 21. Thecomposite material of claim 18, wherein the molecule to be deposited isselected based on the transfer substrate.
 22. The composite material ofclaim 21, wherein the transfer substrate comprises SiO₂, Al₂O₃, GaN, orSiC and the molecule comprises an azide molecule with a phosphate endgroup.
 23. The composite material of claim 21, wherein the transfersubstrate comprises a polymer and the molecule comprises an azidemolecule with an NH₂ end group.
 24. The composite material of claim 18,wherein the growth substrate comprises copper foil.
 25. The compositematerial of claim 18, when the growth substrate comprises a transitionmetal foil.
 26. The composite material of claim 25, wherein thetransition metal foil comprises ruthenium, iridium, nickel, or anycombination thereof.
 27. The composite material of claim 18, wherein thegrowth substrate comprises silicon carbide or boron nitride.
 28. Thecomposite material of claim 18, wherein the transfer substrate comprisesa polymer.
 29. The composite material of claim 18, wherein the transfersubstrate comprises a homopolymer.
 30. The composite material of claim29, wherein the homopolymer comprises polystyrene, polyethylene,polypropylene, or any combination thereof.
 31. The composite material ofclaim 18, wherein the transfer substrate comprises an oxygen containingpolymer, a nitrogen containing polymer, or both.
 32. The compositematerial of claim 18, wherein the transfer substrate comprises apolyester, polyacrylate, polycarbonate, or any combination thereof. 33.The composite material of claim 18, wherein the transfer substratecomprises an inorganic substrate.
 34. The composite material of claim18, wherein the transfer substrate comprises SiO₂, Al₂O₃, GaN, or SiC.